Publications - Articles - ARCNL

J. Guo, S. Tan and C. Xiao, Atomistic understanding of scratching-induced material attrition of wurtzite single-crystal AlN using nanoscale diamond abrasive, Tribol.Int. 169, 107483: 1-9 (2022)
X. Yao, E. Olsson, M. Wang, J.A. Wang, Q. Cai, N.H. Peng, R. Webb and Y. Zhao, Xenon Ion Implantation Induced Surface Compressive Stress for Preventing Dendrite Penetration in Solid‐State Electrolytes, Small, 2108124: 1-9 (2022)
A.C.C. de Beurs, L. Lötgering, M. Herczog, M. Du, K.S.E. Eikema and S. Witte, aPIE: an angle calibration algorithm for reflection ptychography, Opt. Lett. 47, (8), 1949-1952 (2022)
A. Troglia, S. van Vliet, G. Yetik, I.El. Wakil, J. Momand, B.J. Kooi and R. Bliem, Free-standing nanolayers based on Ru silicide formation on Si(100), Phys. Rev. Mater. 6, (4), 043402: 1-8 (2022)
M. Meier, J. Hulva, Z. Jakub, F. Kraushofer, M. Bobić, R. Bliem, M. Setvin, M. Schmid, U. Diebold, C. Franchini and G.S. Parkinson, CO oxidation by Pt-2/Fe3O4: Metastable dimer and support configurations facilitate lattice oxygen extraction, Sci.Adv. 8, (13), eabn4580: 1-8 (2022)
N. Tavakoli, R. Spalding, A. Lambertz, P. Koppejan, G. Gkantzounis, C. Wan, R. Röhrich, E. Kontoleta, A.F. Koenderink, R. Sapienza, M. Florescu and E. Alarcón-Lladó, Over 65% Sunlight Absorption in a 1 μm Si Slab with Hyperuniform Texture, ACS Photonics, (2022)
K. Abrashitova and L.V. Amitonova, High-speed label-free multimode-fiber-based compressive imaging beyond the diffraction limit, Opt. Express 30, (7), 10456-10469 (2022)
R.A. Meijer, D. Kurilovich, K.S.E. Eikema, O.O. Versolato and S. Witte, The transition from short- to long-timescale pre-pulses: Laser-pulse impact on tin microdroplets, J. Appl. Phys 131, (10), 105905: 1-11 (2022)
F.-C. Hsia, C.-C. Hsu, L. Peng, F.M. Elam, C. Xiao, S.E. Franklin, D. Bonn and B. Weber, Contribution of Capillary Adhesion to Friction at Macroscopic Solid–Solid Interfaces, Phys. Rev. Appl. 17, (3), 034034: 1-11 (2022)
G.Z. Li, C. Xiao, S. Zhang, R. Sun and Y. Wu, An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing, J. Mater. Process. Technol. 301, 117453: 1-13 (2022)

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