Publications - Contact Dynamics - ARCNL

T.-D. Terwisscha-Dekker, T. Hogenelst, R. Bliem, B. Weber and D. Bonn, Why Teflon is so slippery while other polymers are not, Phys. Rev. E 107, (2), 024801: 1-6 (2023)
G.Z. Li, C. Xiao, S. Zhang, S. Luo, Y. Chen and Y. Wu, Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer, Tribol.Int. 178, 108087: 1-13 (2023)
Y.H. Liu, H. Zhang, Y. Luo, L. Wang and C. Xiao, Probing the low friction mechanism of hydrogen-free DLC film in oxygen and nitrogen environments by first-principles calculations and molecular dynamics simulation, Surf. Coat. Technol. 455, 129219: 1-11 (2023)
B. Weber, J. Scheibert, M.P. de Boer and A. Dhinojwala, Experimental insights into adhesion and friction between nominally dry rough surfaces, MRS Bulletin 47, (12), 1237-1246 (2022)
L. Peng, F.-C. Hsia, S. Woutersen, M. Bonn, B. Weber and D. Bonn, Nonmonotonic Friction due to Water Capillary Adhesion and Hydrogen Bonding at Multiasperity Interfaces, Phys. Rev. Lett. 129, (25), 256101: 1-6 (2022)
C.-C. Hsu, F.-C. Hsia, B. Weber, M.B. de Rooij, D. Bonn and A.M. Brouwer, Local Shearing Force Measurement during Frictional Sliding Using Fluorogenic Mechanophores, J. Phys. Chem. Lett. 13, (38), 8840-8844 (2022)
C. Xiao, F.-C. Hsia, A. Sutton-Cook, B. Weber and S.E. Franklin, Polishing of polycrystalline diamond using synergies between chemical and mechanical inputs: A review of mechanisms and processes, Carbon 196, 29-48 (2022)
C. Xiao, F.M. Elam, S. van Vliet, R. Bliem, S. Lépinay, N. Shahidzadeh, B. Weber and S.E. Franklin, Intercrystallite boundaries dominate the electrochemical corrosion behavior of polycrystalline diamond, Carbon 200, 1-9 (2022)
C. Leriche, S.E. Franklin and B. Weber, Measuring multi-asperity wear with nanoscale precision, Wear 498-499, 204284: 1-5 (2022)
F.-C. Hsia, C.-C. Hsu, L. Peng, F.M. Elam, C. Xiao, S.E. Franklin, D. Bonn and B. Weber, Contribution of Capillary Adhesion to Friction at Macroscopic Solid–Solid Interfaces, Phys. Rev. Appl. 17, (3), 034034: 1-11 (2022)

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